ATOP Magnetron Sputtering Multi-arc Ion Vacuum Coating Machine For Hardware

 
 
 
1. High deposition rate, High coating speed, It can be widely used to do the decorative coating, functional
 
coating on a variety of products. So it is a ideal equipment to do the high-grade and best coating for mass
 
production.
 

2. Magnetron sputtering principle is based on the theory of the cathode glow discharge, it expend the
 
cathode surface magnetic field near the work piece surface. Then it improves the sputtered atom
 
ionization rate. It keeps the magnetron sputtering uniformity, also can improve the surface shining effect.

 
3. The arc plasma evaporation source is reliable, it can work under 40A current in optimizing the cathode
 
and the magnetic field structure,. It will happen atomic diffusion between the coating and the material. It
 
also has the advantages that lon Beam Assisted Deposition.

 
4. Vacuum pumping system, electric control system and complete vacuum coating system can be
 
customized according to user requirements.
 
 

 
 
It applies to hardware,glass crafts,ceramic crafts,such us watches,mobile phone metal shell,sanitary
 
ware,mould,electronic products,crystal glass, glasses, cutlery, knives and so on.
 
You can make super-hard wear-resistant film coating, anti-corrosion film, decorative film(gold color,rose
 
gold,coffee,brown,bronze,blue,black,white,gray and other colors),it combined with magnetron sputtering
 
technique can be plated the multilayer composite membrane and manufactured plated stainless steel,
 
aluminum, titanium, tungsten and other metal films may be manufactured as coated TIN, TIC, TICN, TIALN,
 
CRN, CU, AU, diamond film (DLC), decorative film metal, film and non-metallic composite coating film and
 
its compounds film.
 

Working Principle

Vacuum magnetron sputtering coating machine working principle:the so-called "splash", the electrons in

an electric field under the action of accelerating the process of flying to the substrate with argon atom

collision, ionization out large amounts of argon ions and electrons.The electron flies toward the substrate,

the argon ion speeds up the target material under the action of the electric field, sputtering out a large

number of target atom, and the neutral target atom (or molecule) is deposited on the substrate to form the

film.Secondary electron in accelerating to fly to the substrate by magnetic field in the process of lorentz

magnetic force, the influence of confined area near the target surface plasma, the plasma density in the

area is very high, secondary electron under the action of magnetic field around the target surface is

circular motion, the electron motion path is very long, constantly in the process of movement of the impact

ionization out large amounts of argon ion bombardment of target, after many times of collision of the

electron energy gradually reduce, cast off the yoke of the magnetic field lines, away from the target

material, the final deposition on the substrate.